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Photolithography Technology

The drive towards smaller sensors, often integrated on monolithic substrates with other processing electronics, has created a need for coatings directly on semiconductor wafers, or on miniaturized substrates that can readily be assembled with active devices. DSI utilizes photolithography to produce a wide array of precision patterned thin film coatings (such as antireflection coatings, bandpass filters, dark mirrors, and metals), with feature sizes as small as 5 µm, on substrates up to 8 inches in diameter. This patterning can be performed directly at the wafer level with singulation performed post-coating, or on individual parts.

  • Filter Arrays
  • Fiducials
  • Apertures
  • Multispectral sensing/imaging
  • Remote Sensing

DSI’s processes enable high feature placement accuracy, the ability to accurately maintain coating spectral properties at the smallest geometries, two sided coating capabilities (for windows), and careful control of internal coating stress to maximize part durability and lifetime. DSI utilizes both positive and negative resist processes, and particularly specializes in supporting customers in the development of coatings for unusual or challenging substrate geometries.

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