DSI offers three coating technologies that accommodate the varied and often rigorous demands placed on thin film coatings. This comprehensive toolbox gives us the ability to provide unique solutions, higher performance, increased volume, and more durability in our coatings.
The MicroDyn® process is a short-throw reactive sputtering process. The process is highly flexible, with the capability to deposit metals, metal oxides, nitrides, mixed materials with fixed or graded compositions, ITO, and semiconductor materials. Selected coatings are capable of operating at temperatures as high as 1000˚C and can withstand the thermal shock of direct transition from liquid nitrogen to boiling water. MicroDyn coatings, including complex filters, can be patterned using both contact masking and photolithography.
The LPCVD process is a thermally driven organo-metallic process that is configured to deposit multi-layers of silicon dioxide, tantalum oxide, and titanium dioxide. LPCVD is a high-temperature process (500˚ C) that provides extremely conformal and seamless coatings on a wide variety of substrates including glass, ceramics, and metals. The unique aspect of the LPCVD process is its capability to uniformly coat all surfaces, even the most complex shapes with a high quality multi-layer optical coating. DSI’s ultra-durable optical coatings also feature laser damage threshold (LDT) levels as high as 25 MW/cm2. These are ideal for use in laser and other high-energy systems such as gas, diode and diode-pumped solid-state (DPSS) systems.
DSI’s evaporative coating chambers are used for complex infrared coatings. Advanced thin-film designs are deposited in precision, cryo-pumped vacuum chambers using electron beam guns and resistance sources with the option of ion assist. Coatings can be laser and nuclear hardened, have minimal scatter and absorption, are space-qualified and meet all applicable military specifications. Infrared coatings with spectral performance requirements out to 25 microns in wavelength can be produced. Metals, metal oxides, dielectrics and semiconductors are deposited on various substrates, some of which include glass, silicon, germanium, zinc sulfide, and zinc selenide.